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Printed Circuit Boards
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Printed circuit boards require utmost precision in production and we provide the finest details of our capabilities to produce the world-class PCBs. The hole diameter, thickness of copper foil, material length, and other descriptions are needed to addressed very carefully, and this is where we spent our maximum effort. Check with our details provided below for various parameters of printed circuit boards:

Description			Capabilities
1.	Materials		FR-1, FR-2 ,CEM-1 / CEM-3 / FR-4
2.	Material Thickness		0.6-1.6mm (2.4mm&3.2mm upon special order)
3.	Copper Foil Weight		0.5oz / 1oz / 2oz / 3oz
4.	Copper Foil Thickness		18um / 35um / 70um(outer layer) 35um / 70um(inner layer)
5.	Minimum Hole size		0.3mm
6.	Minimum hole tolerance		+/-0.05mm(NPTH), +/-0.076mm(PTH)
7.	Hole wall to Conductor	Innerlayers of Multi-layers	0.20mm
8.	Hole to board Edge Gap		0.8mm
9.	Hole to Hole Edge Gap		0.8mm
10.	Minimum Tooling Hole Diameter		1.5mm
11.	Minimum Legend Line width		0.15mm
12.	Minimum Silk printing width		0.15mm
13.	Dimensional Tolerance		Punching:+/-0.1mm;PTH(+/-0.076mm) by drilling; NPTH(+/-0.05mm) by drilling; NPTH(+/-0.1mm) by punching; Remark: 6.0mm hole tolerance by routing is +/-0.13mm
14.	Other Dimensions	Unless other specified	Outline tolerance:+/-0.16mm for routing; +/-0.15mm for punching
15.	Minimum Annular Ring	The least circular strip plane of conductive material surrounding a hole	Inner layer: / Outer layer: - Component holes: 0.2mm Via holes: 0.15mm
16.	Minimum Copper Trace Width	The least noticeable width of the conductor in a circuit path on the printed wiring board	Width/Spacing: 18um/0.5oz, 35um/1oz, 70um/2oz Single Sided: 0.15mm, 0.15mm, 0.2mm
17.	Minimum Spacing	The least distance between adjacent edge of conductors (not-center-to-center)on a single layer of a printed wiring board.	Double Sided: 0.10/0.13 mm, 0.13/0.13 mm, 0.2/0.2mm Multilayer: 0.10/0.13 mm, 0.13/0.13 mm, 0.2/0.2mm
18.	Minimum SMT Pitch	The least distance from center-to-center of adjacent conductive pads	0.4mm
19.	Minimum Soldermask Dam	The least width of soldermask between adjacent conductive pads	Single sided: 0.25mm Double sided: 0.25mm Multilayer: 0.25mm
20.	Minimum Soldermask opening	Difference between pad width and soldermask opening	Single sided: pad width 0.2mm Double sided: pad width 0.1mm Multilayer:
21.	Copper to Board Edge Gap	The least distance between edge of conductors to the edge of the board	0.4mm
22.	Copper to Hole Gap	The least distance between edge of conductors to the edge of the non-plated hole	0.2mm
23.	Minimum Void/Thermal Gaps	The least allowable non-copper contour inside a plane	0.2mmX0.2mm or (diameter=0.5mm)
24.	Acid Trap Closed	gap between two copper entities such as pad or trace	0.2mm