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Printed circuit boards require utmost precision in production and we provide the finest details of our capabilities to produce the world-class PCBs. The hole diameter, thickness of copper foil, material length, and other descriptions are needed to addressed very carefully, and this is where we spent our maximum effort. Check with our details provided below for various parameters of printed circuit boards:
| Description | Capabilities | ||
| 1. | Materials |   | FR-1, FR-2 ,CEM-1 / CEM-3 / FR-4 |
| 2. | Material Thickness |   | 0.6-1.6mm (2.4mm&3.2mm upon special order) |
| 3. | Copper Foil Weight |   | 0.5oz / 1oz / 2oz / 3oz |
| 4. | Copper Foil Thickness |   |
18um / 35um / 70um(outer layer) 35um / 70um(inner layer) |
| 5. | Minimum Hole size |   | 0.3mm |
| 6. | Minimum hole tolerance |   | +/-0.05mm(NPTH), +/-0.076mm(PTH) |
| 7. | Hole wall to Conductor | Innerlayers of Multi-layers | 0.20mm |
| 8. | Hole to board Edge Gap |   | 0.8mm |
| 9. | Hole to Hole Edge Gap |   | 0.8mm |
| 10. |
Minimum Tooling Hole Diameter |   | 1.5mm |
| 11. |
Minimum Legend Line width |   | 0.15mm |
| 12. |
Minimum Silk printing width |   | 0.15mm |
| 13. | Dimensional Tolerance |   | Punching:+/-0.1mm;PTH(+/-0.076mm) by drilling; NPTH(+/-0.05mm) by drilling; NPTH(+/-0.1mm) by punching; Remark: 6.0mm hole tolerance by routing is +/-0.13mm |
| 14. | Other Dimensions | Unless other specified | Outline tolerance:+/-0.16mm for routing; +/-0.15mm for punching |
| 15. |
Minimum Annular Ring
| The least circular strip plane of conductive material surrounding a hole | Inner layer: / Outer layer: - Component holes: 0.2mm Via holes: 0.15mm |
| 16. |
Minimum Copper Trace Width
| The least noticeable width of the conductor in a circuit path on the printed wiring board |
Width/Spacing: 18um/0.5oz, 35um/1oz, 70um/2oz Single Sided: 0.15mm, 0.15mm, 0.2mm |
| 17. |
Minimum Spacing
| The least distance between adjacent edge of conductors (not-center-to-center)on a single layer of a printed wiring board. |
Double Sided: 0.10/0.13 mm, 0.13/0.13 mm, 0.2/0.2mm Multilayer: 0.10/0.13 mm, 0.13/0.13 mm, 0.2/0.2mm |
| 18. |
Minimum SMT Pitch
| The least distance from center-to-center of adjacent conductive pads | 0.4mm |
| 19. |
Minimum Soldermask Dam
| The least width of soldermask between adjacent conductive pads |
Single sided: 0.25mm Double sided: 0.25mm Multilayer: 0.25mm |
| 20. |
Minimum Soldermask opening
| Difference between pad width and soldermask opening |
Single sided: pad width 0.2mm Double sided: pad width 0.1mm Multilayer: |
| 21. |
Copper to Board Edge Gap
| The least distance between edge of conductors to the edge of the board | 0.4mm |
| 22. |
Copper to Hole Gap
| The least distance between edge of conductors to the edge of the non-plated hole | 0.2mm |
| 23. |
Minimum Void/Thermal Gaps
| The least allowable non-copper contour inside a plane | 0.2mmX0.2mm or (diameter=0.5mm) |
| 24. |
Acid Trap Closed
| gap between two copper entities such as pad or trace | 0.2mm |
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